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Title:
防水構造および防水工法
Document Type and Number:
Japanese Patent JP5900785
Kind Code:
B2
Abstract:
One object of the present invention is to provide an interlayer adhesive which can firmly adhere a waterproof layer and an inorganic material layer, and problems of water leak or the like can be suppressed over the long term, and the present invention provides an interlayer adhesive which is interposed between a waterproof layer formed from a resin-coated film and an inorganic material layer using mortar or concrete to adhere the waterproof layer and the inorganic material layer to each other, the interlayer adhesive containing a resin composition obtained by reacting (a) a base resin including an emulsion of a main resin containing at least one of an acrylic-based resin, an ethylene-vinyl acetate-based resin, and an epoxy-based resin, with (b) an isocyanate compound having an isocyanate group.

Inventors:
Katsuhiro Higashi
Tetsuyo Yano
Application Number:
JP2011144138A
Publication Date:
April 06, 2016
Filing Date:
June 29, 2011
Export Citation:
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Assignee:
Daiflex Co., Ltd.
International Classes:
E04D11/00; C09J133/00; E02D29/00; E02D31/02
Domestic Patent References:
JP2002348896A
JP2003049445A
JP2000263995A
JP2007091999A
JP2001200548A
JP7013224B2
JP2004043636A
Attorney, Agent or Firm:
Sumio Tanai
Kazunori Onami
Mitsunaga Igarashi