Title:
Waterproofing structure and a waterproofing construction method
Document Type and Number:
Japanese Patent JP6150867
Kind Code:
B2
Abstract:
One object of the present invention is to provide an interlayer adhesive which can firmly adhere a waterproof layer and an inorganic material layer, and problems of water leak or the like can be suppressed over the long term, and the present invention provides an interlayer adhesive which is interposed between a waterproof layer formed from a resin-coated film and an inorganic material layer using mortar or concrete to adhere the waterproof layer and the inorganic material layer to each other, the interlayer adhesive containing a resin composition obtained by reacting (a) a base resin including an emulsion of a main resin containing at least one of an acrylic-based resin, an ethylene-vinyl acetate-based resin, and an epoxy-based resin, with (b) an isocyanate compound having an isocyanate group.
Inventors:
Katsuhiro Higashi
Application Number:
JP2015217144A
Publication Date:
June 21, 2017
Filing Date:
November 04, 2015
Export Citation:
Assignee:
Daiflex Co., Ltd.
International Classes:
E04D11/00; C09D5/00; C09D201/00; C09J11/06; C09J131/04; C09J133/00; C09J163/00; C09J175/04; E02D29/00; E02D31/02
Domestic Patent References:
| JP2001200548A | ||||
| JP7013224B2 | ||||
| JP2004043636A | ||||
| JP63048916B2 | ||||
| JP60240777A | ||||
| JP50035744B1 | ||||
| JP8296247A |
Attorney, Agent or Firm:
Sumio Tanai
Kazunori Onami
Mitsunaga Igarashi
Kazunori Onami
Mitsunaga Igarashi