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Title:
WATERTIGHT MATERIAL COMPOSITION FOR ELECTRIC WIRE
Document Type and Number:
Japanese Patent JP2001023450
Kind Code:
A
Abstract:

To provide a material composition for manufacturing an electric wire having easily peeling outer coating and watertight structure by mixing a silane cross-linking agent in a resin constituent containing a specific ratio of hot-melt resin to ethylenic resin.

This watertight material composition for an electric wire is prepared by mixing a silane cross-linking agent in a resin composition including 10-50 pts.wt of hot-melt resin to 100 pts.wt of ethylenic resin. A mixing ratio of the hot-melt resin to the ethylenic resin is 10-20 pts.wt to 100 pts.wt desirably. The hot-melt resin is mixed for increasing adhesiveness of the resin constituent. As the silane cross-linking agent, vinyl alkoxy silane such as vinyl trimethoxy silane, vinyl triethoxy silane, vinyl methyldiethoxy silane, vinyl phenyldimethoxy silane, vinyl carboxy silane such as vinyl triacetoxy silane and the like are available.


Inventors:
HARA YUICHI
Application Number:
JP19628099A
Publication Date:
January 26, 2001
Filing Date:
July 09, 1999
Export Citation:
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Assignee:
YAZAKI CORP
International Classes:
H01B7/282; C08K5/5425; C08L23/04; C08L23/08; C08L33/02; C08L35/00; (IPC1-7): H01B7/282; C08K5/5425; C08L23/04; C08L23/08; C08L33/02; C08L35/00
Attorney, Agent or Firm:
Tadashi Hagino (4 outside)