Title:
WAVE SOLDERING APPARATUS, LINEAR MOTOR PUMP THEREFOR, AND OPERATING METHOD FOR THE PUMP
Document Type and Number:
Japanese Patent JPH09172769
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wave soldering apparatus and a linear motor pump therefor wherein uniform solder waves are obtained and solder is prevented from swirling. SOLUTION: The linear motor pump of a wave soldering apparatus 1 has a plurality of liquid conveying ducts 9 placed in parallel with, and separated from, one another. The linear motor pump contains a stator 12 divided into a plurality of segments, and these stator segments 12 are provided with the liquid conveying ducts 9, respectively. This accomplishes uniform pump output, or pump pressure distribution, over virtually any width, and thus uniform solder waves are obtained.
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Inventors:
FLURY KARL (CH)
Application Number:
JP29153396A
Publication Date:
June 30, 1997
Filing Date:
November 01, 1996
Export Citation:
Assignee:
KIRSTEN KABELTECHNIK AG (CH)
International Classes:
B23K1/08; B23K3/06; H02K44/06; (IPC1-7): H02K44/06; B23K1/08; B23K3/06
Attorney, Agent or Firm:
Akasaka Saka (2 people outside)