WAVED SPRING DEVICE

Japanese Patent JP3935979

B2

PROBLEM TO BE SOLVED: To provide a waved spring device which allows the use in a close contact and secures sufficient strength by forming projections and recessions on a circular base with a specified pitch in a circumferential direction, and satisfying a specified formula regarding the minimum radius of curvature of each of the projections and recessions.
SOLUTION: A waved spring device has a circular base 5 on which a plurality of projections and recessions 6 are formed with a specified pitch. The projections and recessions 6 are prepared by continuously and alternate forming circular arcs, that is, projections 6a and recessions 6b each having the same radius of curvature. A minimum radius of curvature R1 of the projections and recessions 6 satisfies a formula 1. With such structure, the device can be arranged in a small space since the projections 6a and recessions 6b, being compressed to be flat, are not broken, allowing high load application. In the case that a strip-like material is bent to form the device, an abutting surface of the waved spring device can be arranged parallely to an object to be abutted. Surface abutting is allowed, so that increase of the pressure generated between both is suppressed, while both the device and the object are prevented from breaking.

WO/2009/051554	SHOCK ABSORBER VALVE WITH SPRING ARRANGEMENT
JP2004279859	DEFLECTING SCANNER

Kenjiro Kawanabe
Yutaka Nishida
Takamura Norito
Ichiro Nagareishi

JP18184995A

June 27, 2007

July 18, 1995

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Nippon Barber Co., Ltd.

F16F1/32; F16B43/00; (IPC1-7): F16F1/32

JP5219852A
JP269114U
JP6297063A
JP269142U
JP6232259U
JP3317109Y1
JP5657476A
JP1210607A
JP3123118U
JP63104718U

Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Sadao Muramatsu
Ryo Hashimoto

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