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Title:
WAVEGUIDE STRUCTURE
Document Type and Number:
Japanese Patent JP2010114650
Kind Code:
A
Abstract:

To provide a waveguide structure formed in divided structure for ensuring excellent heat radiating property and preventing separation of metal-plated film caused by contract friction.

The waveguide structure forming a waveguide as a guiding route includes a first metal member 10 forming a first linear groove 10a at the front surface and a metal-plated second resin member 20 forming a second linear groove 20a at the front surface, wherein the first member 10 and the second member 20 are arranged to provide the first groove 10a and the second groove 20a to be opposed with each other. The front surface of the first member 10 on which the first groove 10a is formed and the front surface of the second member 20 on which the second groove 20a is formed are held with a predetermined clearance 40.


Inventors:
KODAMA KATSUHISA
Application Number:
JP2008285428A
Publication Date:
May 20, 2010
Filing Date:
November 06, 2008
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01P3/12; H01P11/00
Domestic Patent References:
JPH10107515A1998-04-24
JP2004282261A2004-10-07
JP2002076716A2002-03-15
JP2005045341A2005-02-17
JP2003087009A2003-03-20
Attorney, Agent or Firm:
Masuo Oiwa
Toshihide Kodama
Takenaka Ikuo
Keigo Murakami