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Title:
WAVEGUIDE SUBSTRATE
Document Type and Number:
Japanese Patent JP2015076836
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a waveguide substrate capable of achieving electrical connection and signal transmission between a post wall waveguide and an external device without causing deterioration in transmission loss of the post wall waveguide.SOLUTION: In a waveguide substrate 10, a transmission line 20 is laminated on a post wall waveguide 14 comprising: a pair of ground conductor layers 12, 13 formed on facing both surfaces of a dielectric substrate 11; and a pair of post walls 18, 18 comprising posts 15 configured to penetrate through the dielectric substrate 11 so as to connect the pair of ground conductor layers 12, 13. In the waveguide substrate 10, (1) Rz3>Rz0 is satisfied, where Rz0 represents a ten point average roughness Rz on a surface of the ground conductor layers between the ground conductor layers 12, 13 and the dielectric substrate 11, and Rz3 represents a ten point average roughness Rz on a surface of the transmission line between a dielectric layer 22 in contact with the transmission line 20 and the transmission line 20, or (2) the dielectric substrate 11 is made of a liquid crystal polymer or a fluororesin, and the dielectric layer 22 in contact with the transmission line 20 is made of a polyimide-based resin.

Inventors:
UEMICHI YUSUKE
Application Number:
JP2013213681A
Publication Date:
April 20, 2015
Filing Date:
October 11, 2013
Export Citation:
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Assignee:
FUJIKURA LTD
International Classes:
H01P3/12; H01P5/107; H01P11/00; H05K1/02
Domestic Patent References:
JP2010081486A2010-04-08
JPH1174701A1999-03-16
Foreign References:
WO2011052694A12011-05-05
Attorney, Agent or Firm:
Masatake Shiga
Sumio Tanai
Mitsunaga Igarashi
Toshio Komuro
Yuichiro Shimizu