Title:
WAVEGUIDE
Document Type and Number:
Japanese Patent JP2013027038
Kind Code:
A
Abstract:
To enable production of composite material-based waveguides having good EM wave confinement with low dissipation loss.
A method of producing a waveguide 501 is provided which includes, from a ceramic powder and polymer binder slurry, forming and heat-curing the waveguide 501 as a thin stripe connecting electronic integrated circuit (IC) chips on a printed-circuit assembly. The waveguide 501 and the printed circuit assembly produced with the method are also provided.
Inventors:
YEO CHING BIING
MA YUGANG
MASUDA HISASHI
KAWAMURA TAKUSHI
MA YUGANG
MASUDA HISASHI
KAWAMURA TAKUSHI
Application Number:
JP2012125802A
Publication Date:
February 04, 2013
Filing Date:
June 01, 2012
Export Citation:
Assignee:
SONY CORP
International Classes:
H01P3/16; C08K3/22; C08K3/24; C08L23/12; C08L25/06; C08L27/18; C08L101/00; H01P11/00
Attorney, Agent or Firm:
Yoshio Inamoto
Takashi Nishikawa
Takashi Nishikawa