Title:
溶接装置および溶接方法
Document Type and Number:
Japanese Patent JP7060335
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To inhibit adverse affect of a step between metal plates to be butt welded on a welding result.SOLUTION: There is provided a welding device melting a butted part formed by butting first and second metal plates by irradiating them with a laser beam. The device is characterized by comprising: a laser oscillator oscillating laser light for irradiating a processing object including the first and second metal plates therewith; and a diffraction optical element being arranged between the laser oscillator and the processing object and forming a profile having a first peak of power density for melting the first metal plate, a second peak of power density for melting the second metal plate, and a third peak for irradiating butting faces of the first and second metal plates in a rear of irradiation positions of the first and second peaks in a sweep direction of the laser beam.SELECTED DRAWING: Figure 1
Inventors:
Tomomichi Yasuoka
Takashi Kayahara
Toshiaki Sakai
Ryosuke Nishii
Takashi Kayahara
Toshiaki Sakai
Ryosuke Nishii
Application Number:
JP2017080491A
Publication Date:
April 26, 2022
Filing Date:
April 14, 2017
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
B23K26/00; B23K26/21; B23K26/064; B23K26/067
Domestic Patent References:
| JP2016209925A | ||||
| JP2011224655A | ||||
| JP8257773A | ||||
| JP2017030010A | ||||
| JP2012130946A | ||||
| JP62144888A | ||||
| JP2001047272A | ||||
| JP2007229773A |
Attorney, Agent or Firm:
Sakai International Patent Office