Title:
WELDING STRUCTURE, COOLING STRUCTURE, AND MANUFACTURING METHODS OF WELDING STRUCTURE AND COOLING STRUCTURE
Document Type and Number:
Japanese Patent JP2014152986
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a welding structure and a cooling structure which are used for, for example, cooling a portable base station etc. on which a semiconductor device is mounted and manufacturing methods of the welding structure and the cooling structure, and to inhibit bending of a container for storing a refrigerant.SOLUTION: A groove 12 formed by reducing a thickness of a cover 4 is formed in a portion of the cover 4, which is located near a welding part 9 where an outer periphery part of the cover 4 is joined to a portion of a container 1 located close to the outer periphery part, being arranged substantially parallel to the welding part 9. Thus, when a melting portion is cooled to become hard, an area located closer to the welding part 9 side relative to the groove 12 of the cover 4 is pulled. As a result, an outer surface of a bottom surface of the container 1 is inhibited from being curved.
Inventors:
NAKANO YUJI
MASUDA YUTO
MASUDA YUTO
Application Number:
JP2013022895A
Publication Date:
August 25, 2014
Filing Date:
February 08, 2013
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
F28D15/02; H01L23/427; H05K7/20
Attorney, Agent or Firm:
Hiroki Naito
Fujii Kentaro
Terauchi Italian 久郎
Fujii Kentaro
Terauchi Italian 久郎