To provide a method suitable for executing wet etching while sufficiently protecting a protection target, and also to provide a micro movable element that is manufactured by utilizing the method.
The wet etching method includes: a process in which a groove extended along the protection target of a processed structure is formed to the processed structure; a process in which an etchant-resistant protection film covering the protection target and the groove and partially entering the groove is formed on the processed structure; and a process for making an etchant act on the processed structure. The micro movable element X1 is provided with a base substrate, a fixture 11 joined to the base substrate, a movable part 12 extended along the base substrate by being extended from the fixture 11, and a piezoelectric driver 15 provided over the movable part 12 and the fixture 11 on the side opposite to the base substrate. A groove 17 extended along the piezoelectric driver 15 is provided to the movable part 12 and/or the fixture 11.
NAKATANI TADASHI
SHIMAUCHI TAKEAKI
IMAI MASAHIKO
UEDA TOMOSHI
| JP2007504608A | 2007-03-01 | |||
| JP2002043273A | 2002-02-08 | |||
| JPH0917300A | 1997-01-17 | |||
| JPH07312361A | 1995-11-28 | |||
| JPS5279654A | 1977-07-04 | |||
| JP2002246363A | 2002-08-30 | |||
| JPH0774246A | 1995-03-17 |
Tatsuya Tanaka