Title:
ウエットエッチング方法及びウエットエッチング装置
Document Type and Number:
Japanese Patent JP5024048
Kind Code:
B2
Abstract:
A fine pattern is formed on a surface of a processing object without using photoresist. A wet etching for the processing object in an area to which ultraviolet light is applied is performed by bringing a solution in which nitrous oxide (N2O) is dissolved into contact with the processing object and applying the ultraviolet light to the solution in a vicinity of an area to the processing object other than portions shielded with a mask whereupon a light shielding pattern is formed.
Inventors:
Ryuji Sotoka
Keiichi Tanaka
Tomoyuki Higashi
Keiichi Tanaka
Tomoyuki Higashi
Application Number:
JP2007545302A
Publication Date:
September 12, 2012
Filing Date:
November 17, 2006
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
H01L21/306; C23F1/02; C23F1/14; H05K3/06
Domestic Patent References:
| JP2001068448A | 2001-03-16 | |||
| JP2005136013A | 2005-05-26 | |||
| JP2005268380A | 2005-09-29 | |||
| JPH06260477A | 1994-09-16 | |||
| JPS609882A | 1985-01-18 | |||
| JPS6486521A | 1989-03-31 |
Attorney, Agent or Firm:
Kenichiro Matsuo