Title:
片面式高スループットの湿式エッチングおよび湿式処理装置および方法
Document Type and Number:
Japanese Patent JP5593233
Kind Code:
B2
Abstract:
A processing system includes a plurality of chucks, each of the chucks configured to support a substrate such that a bottom surface of the substrate is exposed, a track configured to guide the plurality of chucks along a continuous path, and a processing arrangement configured to process the bottom surface of each substrate when the track guides the respective chuck over the processing arrangement, the processing arrangement including a fluid meniscus arranged to contact the bottom surface of each substrate when the track guides the respective chuck over the processing arrangement.
Inventors:
Ricardo eye Fuentes
Application Number:
JP2010547838A
Publication Date:
September 17, 2014
Filing Date:
February 23, 2009
Export Citation:
Assignee:
マテリアルズ And Technologies corporation
International Classes:
H01L21/677; B65G49/06; B65G49/07; H01L21/683
Attorney, Agent or Firm:
Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Jitsuhiro
Masatake Shiga
Takashi Watanabe
Shinya Jitsuhiro