Title:
WHEAT FLOUR FOR NOODLE SKIN
Document Type and Number:
Japanese Patent JP2023048374
Kind Code:
A
Abstract:
To provide a wheat flour for noodle skin that enables the production of noodle skin having an excellent texture.SOLUTION: A wheat flour for noodle skin has the following properties: a crude protein content of 8.5-11.5 mass%, an average particle size of 80-150 μm, and an ash content of 0.25-0.55 mass%.SELECTED DRAWING: None
More Like This:
| JP2001346532 | METHOD FOR PRODUCING SOYBEAN-CONTAINING NOODLE |
| JP2003250474 | METHOD OF PRODUCING COOKED NUTRIENT-ENHANCED PASTA |
| JP2007089403 | METHOD FOR MAKING CARBONARA |
Inventors:
MACHIDA TAE
ODA KENJI
TSUDA YASUYUKI
KIMOTO MASAAKI
KOGO YUKAKO
ODA KENJI
TSUDA YASUYUKI
KIMOTO MASAAKI
KOGO YUKAKO
Application Number:
JP2021157647A
Publication Date:
April 07, 2023
Filing Date:
September 28, 2021
Export Citation:
Assignee:
NISSHIN FLOUR MILLING INC
International Classes:
A23L7/109; A23L35/00
Attorney, Agent or Firm:
Arga Patent Office