Title:
WIDTH-ALIGNING APPARATUS ON INLET SIDE OF BINDING APPARATUS, AND ITS USING METHOD
Document Type and Number:
Japanese Patent JP2003252302
Kind Code:
A
Abstract:
To enable a next mound to be received by a width aligning apparatus while arranging and binding a mound of articles to be bound until the mound is fed to a binding apparatus and preventing the mound from collapsing.
A width-aligning board for the width-aligning apparatus 12 is divided into a main width-aligning board 121a and a subsidiary width-aligning board 122, and respective boards are made independently openable/closable. In this case, the main width-aligning board 121a is confronted with a loading location for the article to be bound on the conveyor 11. The subsidiary width- aligning board 122 is confronted with a section being closer to the binding apparatus.
Inventors:
Miyata, Hiroshi
Furukawa, Hiroichi
Furukawa, Hiroichi
Application Number:
JP2002000053849
Publication Date:
September 10, 2003
Filing Date:
February 28, 2002
Export Citation:
Assignee:
YAMADA KIKAI KOGYO CO LTD
International Classes:
B65B13/18; B65B27/08; B65B13/18; B65B27/08; (IPC1-7): B65B13/18; B65B27/08