Title:
巻線装置
Document Type and Number:
Japanese Patent JP7175126
Kind Code:
B2
Abstract:
To provide a winding device capable of applying a resin in a device during winding of a wire and manufacturing a high-quality multilayer coil.SOLUTION: A winding device 1 that manufactures a multilayer coil 10 by winding a wire 11 along a winding core 21 includes a bobbin 2 having a core 21 and winding the wire 11 by rotation of the shaft, and a coating roll 91 formed of a cylindrical body having a resin adhered to a circumferential surface thereof, adjacent to the multilayer coil 10 in the bobbin 2 on the circumferential surface, and transferring the resin to the multilayer coil 10 in the bobbin 2 by axial rotation.SELECTED DRAWING: Figure 2
Inventors:
Takayuki Shibasaki
Hiroyuki Aoshima
Hiroyuki Aoshima
Application Number:
JP2018148779A
Publication Date:
November 18, 2022
Filing Date:
August 07, 2018
Export Citation:
Assignee:
Toshiba IT Control System Co., Ltd.
International Classes:
H01F41/04; H01F41/12
Domestic Patent References:
| JP60161608A | ||||
| JP63009532A | ||||
| JP55165167A | ||||
| JP2001006922A | ||||
| JP6132157A | ||||
| JP4247610A | ||||
| JP63050009A | ||||
| JP2007209140A | ||||
| JP60143615A | ||||
| JP2012033386A |
Foreign References:
| US20110057752 |
Attorney, Agent or Firm:
Mitsuharu Kiuchi