Title:
WINDING, MANUFACTURING APPARATUS THEREOF AND MANUFACTURING METHOD OF WINDING
Document Type and Number:
Japanese Patent JP2018098407
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a winding and a manufacturing apparatus thereof capable of achieving a desired space factor, which is superior in manufacturing efficiency and quality, and manufacturing method of winding.SOLUTION: A manufacturing apparatus of winding in an embodiment has control means that controls first bending means to carry out a series of bending processing in order based on the feed amount of a single wire by a feeder, including: processing the wire into a shape to form a first winding part for winding while overlapping with the outer periphery; and processing the wire into a shape to form a second winding part for winding the wire overlapping with the inner periphery; and a second bending means to carry out a series of bending processing on a part, which is equivalent to a part between the first winding part and a second winding part, into a shape to displace to a lamination direction.SELECTED DRAWING: Figure 1
Inventors:
SHIODA HIROSHI
TSUJIMURA YUSUKE
MASUDA TAKESHI
TSUJIMURA YUSUKE
MASUDA TAKESHI
Application Number:
JP2016243234A
Publication Date:
June 21, 2018
Filing Date:
December 15, 2016
Export Citation:
Assignee:
TOSHIBA IND PRODUCTS & SYSTEMS CORP
International Classes:
H01F41/04; H01F5/00; H01F5/06; H02K15/04
Domestic Patent References:
| JP2014096402A | 2014-05-22 | |||
| JPH08317610A | 1996-11-29 | |||
| JP2014017279A | 2014-01-30 | |||
| JPS5840812A | 1983-03-09 | |||
| JP2006196682A | 2006-07-27 | |||
| JP2000217315A | 2000-08-04 |
Attorney, Agent or Firm:
Patent Business Corporation Sato International Patent Office
Previous Patent: Solar cell module
Next Patent: A cooling method of a semiconductor device, a cooling device of a semiconductor device, and a semico...
Next Patent: A cooling method of a semiconductor device, a cooling device of a semiconductor device, and a semico...