To provide a new wipe solvent composition for cleaning and priming the surface of a substrate such as that of metal, composite material, glass, plastic or other material.

The invention relates to the wipe solvent composition for cleaning and priming a substrate and for depositing on the substrate a residue comprising a polyfunctional coupling agent and an adhesion promoter, wherein the composition comprises (a) 95-99.9% by volume of an environmentally-acceptable volatile organic solvent having a composite vapor pressure below about 45 mmHg, (b) 0.1-5% by volume of 3-glycidoxypropyltrimethoxysilane polyfunctional coupling agent, and (c) 0.1-5% by volume of an adhesion promoting agent selected from a group consisting of (i) bis[3-(trialkoxysilyl)alkyl]hydromuconic acid, (ii) bis[3-(trialkoxysilyl)alkyl]succinate, (iii) bis[3-(trialkoxysilyl)alkyl]phthalic acid, and (v) bis [3-(trialkoxysilyl)alkyl]pyridine-2, 6-dicarboxylic acid, wherein the alkyl groups contain from 1 to about 8 carbon atoms.