Title:
WIRE BINDING APPARATUS OF DISTRIBUTING BOARD
Document Type and Number:
Japanese Patent JP2002171649
Kind Code:
A
Abstract:
To simplify work for binding wires and prevent a loss of binding bands.
A wire binding apparatus 2 comprises a resinous binding band 4 and a resinous mounting tool 5 for mounting the binding band inside a case 1 of a distributing board. A clip 7 for clipping the binding band 4 is integrally formed on a base 6 of the mounting tool 5. The clip 7 is provided with a hooking piece 8 for hooking the binding band 4 and a pair of left and right holding pieces 9 for pressing the binding band 4 to the hooking piece 8 and holding the curved binding band 4. Slits 11, in which the binding band is inserted or detached in the direction of width, are formed between the hooking piece 8 and the holding pieces 9.
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Inventors:
MIZUNO KOJI
Application Number:
JP2000365798A
Publication Date:
June 14, 2002
Filing Date:
November 30, 2000
Export Citation:
Assignee:
KAWAMURA ELECTRIC INC
International Classes:
B65D63/14; F16B2/08; H02B1/20; H02B1/40; H02G3/30; (IPC1-7): H02G3/30; B65D63/14; F16B2/08; H02B1/20; H02B1/40
Domestic Patent References:
| JPH0965520A | 1997-03-07 | |||
| JPH04193179A | 1992-07-13 | |||
| JPH07264732A | 1995-10-13 | |||
| JP2000201407A | 2000-07-18 |
Attorney, Agent or Firm:
Ishida Kiki
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