Title:
ワイヤボンダーの座標検出順序決定装置
Document Type and Number:
Japanese Patent JP3567644
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To decide the coordinate detection order of electrode pads and a wiring order rapidly and properly, and to enable reducing a tact time in a wire bonding process by a method, wherein the decision device is provided with a means for deciding the coordinate detection order, so that the moving distance of a bonding head becomes shortest. SOLUTION: A detection order decision part 14 decides the coordinate detection order of electrode pads and the leading bonding point of bonding points, so that the moving distance of a bonding head, which is calculated in a moving distance calculating part 13, becomes shortest on the basis of the case, where the coordinates of the electrode pads are detected according to a coordinate decision order obtainable from a device information input part 11, Also the case, where the coordinates of the pads are detected according to coordinate detection orders, which are set in the order in a detection order operating part 12. A wiring order decision part 15 decides a wiring order, so that a wire bonding is performed in the order from an electrode pad row, including the electrode pad, which is first wire-bonded after the coordinates of the pads are detected, to the other electrode pad rows with the leading bonding point, which is decided in the decision part 14, that is, the electrode pad, which is first wire-bonded, as the starting point.
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Inventors:
Toshiya Hirai
Application Number:
JP25306796A
Publication Date:
September 22, 2004
Filing Date:
September 25, 1996
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/68; H01L21/60; (IPC1-7): H01L21/60; H01L21/68
Domestic Patent References:
| JP897241A | ||||
| JP585043U | ||||
| JP63244636A | ||||
| JP57167645A |
Attorney, Agent or Firm:
Mihiro Uchino
Kenichiro Matsuo
Kenichiro Matsuo