Title:
WIRE BONDER
Document Type and Number:
Japanese Patent JP3255801
Kind Code:
B2
Abstract:
PURPOSE: To obtain a wire bonder for connecting a chip of pin grid array electronic device with the electrode on a board through a wire while moving a capillary tool held by a horn up and down in which the vertical stroke of the capillary tool can be shortened.
CONSTITUTION: The wire bonder comprises a table 20 for positioning a board 2 mounting a pin grid array electronic device 1, and a mechanism 21 for moving the table 20 up and down. When the table 20 is moved up and down through the mechanism 21, the vertical stroke of a capillary tool 35 is partially occupied by the mechanism and thereby it is shortened.
Inventors:
Waki Eisuke
Application Number:
JP16374994A
Publication Date:
February 12, 2002
Filing Date:
July 15, 1994
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP6098633A | ||||
| JP61159747A | ||||
| JP62125639A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)
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