PURPOSE: To obtain a bonding technique for enhancing operability and bondability by so standing a sidewall at the end of a discharge electrode as to at least cross the flowing direction of gas supplied from gas supply means.
CONSTITUTION: Reducing gas 21 diffused from a tube 18 is blown to a sidewall 20 so disposed as to cross a diffusing direction to form a predetermined gas atmosphere near the end of a wire 5. Then, a capillary 11 is moved down by a bonding head 9 to gradually press a ball 5a to the pad of a pellet 2. Since the pellet 2 is heated by a heating block 7 at this time, the ball 5a is thermally press-bonded to the pad of the pellet 2. The ball 5a is held in the predetermined gas atmosphere to be suppressed to be oxidized. Thus, the bonding with prefer able bondability is performed. In this manner, a wire bonding apparatus which can bond with preferable bondability is obtained.
OHASHI YOSHIO
IIZAKA SUSUMU
CHUMA TOSHIO
TANI YUKIO
HITACHI TOKYO ELECTRONICS