Title:
WIRE BONDING DEVICE AND METHOD THEREOF
Document Type and Number:
Japanese Patent JP2568140
Kind Code:
B2
Abstract:
PURPOSE: To accurately discriminate and detect the breaking of wire, abnormal discharge, normal discharge and the like by a method wherein high frequency voltage or pulse is applied to a discharge electrode, and the frequency voltage or pulse voltage in accordance with the discharge voltage of the discharge electrode is detected.
CONSTITUTION: The high frequency voltage or pulse generated by a high frequency voltage generator (or square wave pulse generator) 3 is applied to a discharge electrode 17 in a wire bonding device, the high frequency voltage or pulse voltage in accordance with the discharge voltage of the discharge electrode 17 is detected by a voltage detector 4, the detected voltage and the reference voltage are compared by a comparator 6, and based on the above- mentioned comparison output, the disconnection of wire, abnormal discharge, normal discharge, etc., between the discharge electrode 17 and a wire 20 are discriminated and detected by a detector 8.
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Inventors:
URA MASANAO
Application Number:
JP23687691A
Publication Date:
December 25, 1996
Filing Date:
August 26, 1991
Export Citation:
Assignee:
KAIJO KK
International Classes:
H01L21/60; (IPC1-7): H01L21/60; H01L21/60
Domestic Patent References:
| JP549574A | ||||
| JP5764944A | ||||
| JP521501A | ||||
| JP547827A |
Attorney, Agent or Firm:
Shoji Hagiri