To provide a wire bonding device which can always apply a fixed bonding load to pads and leads, without being affected by the elasticity of the leaf spring for the bonding arm of a bonding head at applying the bonding load to the pads and leads by using the plate spring for supporting the bonding arm.

A wire bonding deice is provided with position detecting means 35, 11, 12, and 13 which detect the position of a capillary, a servo control circuit 10 which controls the drive for a linear motor 24, and an amplifier which outputs a correcting signal (b) which corrects the elasticity generated in an elastic body from the present position of a bonding arm which is detected by means of the position detecting means 35, 11, 12, and 13. The wire bonding device always applies a fixed bonding load to pads and leads by adding the correcting signal (b) from an amplifier 14 to a signal (a) from a servo control circuit 10.