Title:
WIRE BONDING DEVICE
Document Type and Number:
Japanese Patent JPS5563833
Kind Code:
A
Abstract:
PURPOSE:To operate the bonding tool efficiently and reduce operational cost, by specifying the speed of up-and-down movement of the bonding tool with respect to its plane displacement at the time of wire bonding. CONSTITUTION:The bonding tool at the time of wire bonding waits for the completion of its plane movement in time T0-T1, and operates the bonding of pellet 1 to electrode 2 in time T1-T4, waits for the completion of its movement to lead 3 in time T4-T5 and operates bonding specified position 4 on lead 3 in time T5- T8. The time during which the bonding tool remains at a high position, namely, the time of its plane movement, is lengthened or shortened in accordance with the magnitude of its plane displacement l. To accomplish this, the rotation of a motor, which makes up-and-down movement, is made into two stages, and by calculating from the information on the bonding position, the high and low rotations are determined, or the switching to the low speed is done with the start of its plane movement. By this, a series of wire bonding operations can be done efficiently, and thereby operational cost can be reduced.
Inventors:
TAKASUGI NOBUHIRO
KIYOUMASU RIYUUICHI
TAKASHIMA KAZUHISA
KIYOUMASU RIYUUICHI
TAKASHIMA KAZUHISA
Application Number:
JP13681778A
Publication Date:
May 14, 1980
Filing Date:
November 08, 1978
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/60; (IPC1-7): H01L21/60