Title:
WIRE BONDING DEVICE
Document Type and Number:
Japanese Patent JPS5683041
Kind Code:
A
Abstract:
PURPOSE:To prevent the jumping action of the wire bonding device by a method wherein two springs to activate a bonding arm are provided, the arm is activated by the two springs until just before a capillary is transferred at a pellet, and after then the arm is activated only by one spring. CONSTITUTION:The bonding arm 1 transfers the capillary 1a to the direction of the pellet 4 being applied with turning effort by the force of the springs 2, 7d making axes 10, 7a as centers. When a timing signal is sent to a solenoid 7f to activate it just before the capillary 1a comes in contact with the pellet 4, a lever 7b rotates in the clockwise direction and the capillary 1a comes in contact with the pellet 4 only by the force of the spring 2 to perform ultrasonic welding. When the timing is ended, the activation of solenoid is stopped to make the capillary to be returned to the original position by the force of the springs 2, 7d. By this way, the capillary is made to enable the transference in a high speed and without shock.
Inventors:
NAKASHIMA KIYOKATA
Application Number:
JP15922579A
Publication Date:
July 07, 1981
Filing Date:
December 10, 1979
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
H01L21/60; (IPC1-7): H01L21/60