Title:
ワイヤボンディング装置
Document Type and Number:
Japanese Patent JP4535235
Kind Code:
B2
Abstract:
In an bonding apparatus, a piezoelectric element 4 being built into the vicinity of the capillary attachment portion of a bonding arm 1 so that the capillary 3 can be caused to vibrate in the axial direction of the bonding arm 1. The preparatory pressure application device that applies a preparatory pressure to the piezoelectric element 4 includes two wedge-form attachment bases 5 and 6 which are disposed to the rear of or behind the piezoelectric element 4, and a preparatory pressure bolt 7 which is screwed into the wedge-form attachment base 6 from the outside of the bonding arm 1; and a preparatory pressure is applied to the piezoelectric element 4 by the movement of the wedge-form attachment base 5 in the axial direction of the bonding arm 1 caused by the rotation of the preparatory pressure bolt 7.
Inventors:
Yutaka Kondo
Application Number:
JP2004045130A
Publication Date:
September 01, 2010
Filing Date:
February 20, 2004
Export Citation:
Assignee:
Shinkawa Co., Ltd.
International Classes:
H01L21/60; B23K20/00; B23K20/10; B23K37/00; H01L21/607; H01L41/09; H02N2/00
Attorney, Agent or Firm:
Yoshinori Tanabe