Title:
WIRE BONDING INSPECTION METHOD AND WIRE BONDING INSPECTION DEVICE
Document Type and Number:
Japanese Patent JP2015114242
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To efficiently determine the quality of bonding.SOLUTION: A bonding tool 15 from a tip of which part of wire extends is lowered toward an electrode 52 of a semiconductor device; (b) the part of the wire is bonded on a predetermined electrode of the semiconductor device; (c) the bonding tool is moved along a predetermined locus while feeding the wire from the tip of the bonding tool; and the part of the wire extended from the tip is moved to above a lead part of a lead frame 60. Then, the part of the wire is bonded on the lead part of the lead frame and the wire is cut. In (b) and (c), the wire is supplied with application voltage having a polarity opposite to that for a part corresponding to a diode 53 between a substrate part of the semiconductor device and the predetermined electrode for bonding; and a voltage value based on current flowing according to a potential difference between the application voltage and a reference potential of the lead frame is detected to inspect the quality of bonding.
Inventors:
YOSHIMURA TOSHIRO
Application Number:
JP2013257352A
Publication Date:
June 22, 2015
Filing Date:
December 12, 2013
Export Citation:
Assignee:
SHINKAWA KK
International Classes:
G01R31/26; H01L21/60
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
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