PURPOSE: To improve efficiency in wire-bonding work and precision of coupling positions, by bonding the tip-end parts of wires with chip-side electrode pads, bonding the extending parts of wires with base-side electrode pads, and then cutting extra-extended parts of the wires.

CONSTITUTION: A pair of rails 1-1 are installed extending through a wire- bonding work station S on a bed B. And freely-movable supporting boards 2, on which a chip-mounting base P is mounted with a semiconductor chip 3 jointed on a package base 4, are set on the rails 1-1. And these supporting boards 2 are moved intermittently in turn so that a chip-mounting base p can be intermittently carried to the wire-bonding work station S, and a wire compression bonder A is arranged on the upper side of the station S. On the central part of a package base 4 in a rectangular-plate shape, the semiconductor chip 3 is connected in smaller rectangular-plate shape, to form the chip-mounting base P.