Title:
WIRE BONDING METHOD
Document Type and Number:
Japanese Patent JP3902640
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To reduce the residues of a tail on a gold bump of a second bonding point, and to stably perform bonding.
SOLUTION: After a gold wire 5 is connected to a bonding electrode 4 (a first bonding point), a capillary 6 is pressed against a top surface of the gold bump 10 previously formed on a bonding pad 3 (the second bonding point), to pressure-weld the gold wire 5 and the gold bump 10, for chapping the gold wire 5. Then the capillary 6 is slightly raised and a tip part of the capillary 6 is moved in a opposite direction to the direction of the bonding electrode 4 along the top surface of the gold bump 10 by about 40-120% of the diameter of the gold wire 5, to expand the chap. Then the gold wire 5 is drawn upward by clamping with a wire clamper 9, to cut the gold wire 5 at the part where the chap is formed.
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Inventors:
Takei Makoto
Application Number:
JP2002214584A
Publication Date:
April 11, 2007
Filing Date:
July 23, 2002
Export Citation:
Assignee:
Sharp Takaya Electronics Co., Ltd.
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP2002517092A |
Attorney, Agent or Firm:
Eiichi Suda
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