PURPOSE: To surely perform the bonding of the following time by preventing the displacement of the cut end, by cutting a wire by drawing it along the lead-out part at the tool lower end by holding it with a clamper, after completion of the bonding.

CONSTITUTION: The electrode 14 of the above of a semi-conductor chip 13 and the terminal 16 of a lead frame are subjected to a bonding with a wire 15. After completion of the bonding, a tool 12 and clamper 11 are lifted in the prescribed quantity. The wire 15 is then cut by drawing the clamper 11 along the tool lead-out part 17 in the direction shown by an arrow mark (b) by closing the clamper 11. As a result, the cut end is not displaced because the cut end is cut by abutting to the lead-out part 17 in a recessed sectional shape. Consequently, the wire 15 is correctly pressed onto the electrode and a sure bonding can be performed.