Title:
WIRE BONDING
Document Type and Number:
Japanese Patent JPH065651
Kind Code:
A
Abstract:
PURPOSE: To make a device continue bonding operation without making the device stop even in the case where the formation of a ball is not conducted normally.
CONSTITUTION: Discharge is generated between a discharge electrode 7 and the point part of a wire 11 made to project front a capillary 6 and the formation state of a ball 11a formed by this discharge is decided by a discharge state decision device 15. In the case where the formation state is decided that it is a defective state, an extra bonding is performed at an extra bonding position on a lead frame 1 and after that, a ball is again formed by discharge to make a device continue a normal bonding operation.
Inventors:
SHINKAWA TAKEYUKI
Application Number:
JP18598992A
Publication Date:
January 14, 1994
Filing Date:
June 19, 1992
Export Citation:
Assignee:
TOSHIBA SEIKI KK
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Next Patent: WIRE BONDING DEVICE