Title:
WIRE COIL BINDING METHOD AND WIRE COIL FORMING DEVICE
Document Type and Number:
Japanese Patent JP2023042865
Kind Code:
A
Abstract:
To provide a novel method of binding wire coils that can increase wire density in the wire coils while suppressing scratches on the wire surface during binding.SOLUTION: A method for binding wire coils W formed by winding a wire S in a cylindrical shape, includes the following steps: by using a stand 4 provided with a coil outer diameter defining member 6 that defines the outer diameter dimension of the wire coil W facing the outer peripheral surface of the wire coil W, and standing the wire coil W so that the axis of the cylinder faces up and down is supported by the stand 4, and while pressurizing from the axial direction, swinging the stand 4 in the circumferential direction of the wire coil W to move the wires S in the wire coil W relative to each other in the circumferential direction, thereby increasing the density of the wire S in the wire coil W, and then binding.SELECTED DRAWING: Figure 2
Inventors:
MAEKAWA FUTOSHI
JUFUKU MAKOTO
JUFUKU MAKOTO
Application Number:
JP2021150261A
Publication Date:
March 28, 2023
Filing Date:
September 15, 2021
Export Citation:
Assignee:
DAIDO STEEL CO LTD
International Classes:
B65B13/20; B65B27/06
Attorney, Agent or Firm:
Akio Iida
Michiko Ema
Isao Namagawa
Michiko Ema
Isao Namagawa
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