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Patent Searching and Data


Title:
WIRE DELIVERY DEVICE
Document Type and Number:
Japanese Patent JP2006206291
Kind Code:
A
Abstract:

To provide a wire delivery device capable of solving such conventional problems depending upon the size of its wire storing means for wires to be wound round, that a thick wire or a large quantity of wire wound round causes a large outside diameter of the winding part of the wire storing means, resulting in a large angle formed to a wire supplying hole leading to the body, which should increase remarkably the friction resistance at the wire supplying hole, and that a slip is generated in the grasping action of a chuck body to the wire in association with the increase of the friction resistance, resulting in a risk of no wire being paid off.

The wire delivery device to deliver the wire consisting of a soft material is structured so that the wire storing means with the soft wire wound round is installed on the body removably and a wire guide hole is provided to lead the wire from the storing means to the body, wherein the line tying the contour of the wire storing means to the wire guide hole is made 25° or less with respect to the center axis.


Inventors:
MARUYAMA SHIGEKI
Application Number:
JP2005023115A
Publication Date:
August 10, 2006
Filing Date:
January 31, 2005
Export Citation:
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Assignee:
PENTEL KK
International Classes:
B65H57/00