Title:
WIRE DRAWING DIE FOR EXTRA FINE WIRE, AND METHOD FOR MACHINING AND REPAIRING THE SAME
Document Type and Number:
Japanese Patent JP2005254302
Kind Code:
A
Abstract:
To provide a wire drawing die in which no breakage occurs in manufacturing an extra fine wire, the diameter of the die is 5-50 μm and the dimensional accuracy is about ±0.1 μm, and to provide a method for machining and repairing the wire drawing die in which the die diameter or the like of the wire drawing die can be machined with the dimensional accuracy by using an FIB (focused ion beam).
In the wire drawing die for an extra fine wire, the dimensional accuracy for the die diameter is 5-50 μm with the dimensional accuracy of ±0.1 μm by projecting condensed ion beams on a bearing part of the wire drawing die.
Inventors:
YAMADA TSUYOSHI
MIMURA SHOJI
SAITO TAKASHI
MIMURA SHOJI
SAITO TAKASHI
Application Number:
JP2004071182A
Publication Date:
September 22, 2005
Filing Date:
March 12, 2004
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
B23K15/00; B21C1/00; B21C3/02; B23K101/20; (IPC1-7): B21C3/02; B21C1/00; B23K15/00
Attorney, Agent or Firm:
Takeo Masuda