Title:
WIRE DRAWING DIE AND GRINDING METHOD THEREFOR
Document Type and Number:
Japanese Patent JPH1157843
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To prolong a die life, reduce an electricity consumption at a time of the wire drawing, improved a linearity of a wire material, and reduce the breaking of the wire by forming a reverse tapered angle, diameter of an exiting hole of which is larger than that of an intaking hole, at a bearing for the wire drawing die. SOLUTION: A bell 2 and a nib 1 (the wire drawing die) are made to rotate. A circular cone needle 7 is formed into a back relief side from an approach side, pouring an abrasive A from the approach side, and grinds an approach surface 40. The circular cone needle 7 is drawn out. The circular cone needle 7 has a circular face cone 70, an angle of which is the same as that of the approach. A round bar needle 8 is forced into the approach side from the back relief side pouring the abrasive A from the approach side, and grinds a bearing face 50. The round bar needle 8 has a straight face 80, an outer shape size of which is in compliance with the bearing restoration purpose. The abrasive A is an aqueous one containing a low viscous glycerine of 10-30 cPs added by, as a viscous conditioner, 20-40 wt.% of a high viscous glycerine of 100-300 cPs and by an abrasive grain.
Inventors:
NAKAYAMA MAKOTO
Application Number:
JP24457297A
Publication Date:
March 02, 1999
Filing Date:
August 26, 1997
Export Citation:
Assignee:
TOKYO SEIKO CO LTD
International Classes:
B24B5/48; B21C3/02; B21C3/18; (IPC1-7): B21C3/02; B21C3/18; B24B5/48
Attorney, Agent or Firm:
Yasuhiro Kuroda