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Patent Searching and Data


Title:
WIRE MODULE
Document Type and Number:
Japanese Patent JP2016025763
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To make it possible to easily form a cylindrical shape part capable of accommodating a wire by bending a plate.SOLUTION: A wire module 10 includes: a wire 12; and a protective member 20. The protective member 20 is so formed that a bendable plate 30 is bent so as to form a cylindrical shape part 32 capable of accommodating the wire 12 while extending both side edge parts 34, 36 of the plate 30 outward. For instance, both side edge parts 34, 36 of the plate 30 are bonded in an overlapped state. Further, for instance, a penetration holding member penetrates both side edge parts 34, 36 of the plate 30.SELECTED DRAWING: Figure 1

Inventors:
HACHIYA YOSHIKAZU
ITO HIDEAKI
MIZUNO YOSHIMASA
Application Number:
JP2014148654A
Publication Date:
February 08, 2016
Filing Date:
July 22, 2014
Export Citation:
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Assignee:
AUTO NETWORK GIJUTSU KENKYUSHO
SUMITOMO WIRING SYSTEMS
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H02G3/04; B60R16/02
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita