Title:
WIRE TREATING SYSTEM AND WIRE TREATING METHOD
Document Type and Number:
Japanese Patent JP2022063762
Kind Code:
A
Abstract:
To automatically and accurately remove a joined part of wires to be treated.SOLUTION: A delivery part 110 delivers a wire to be treated obtained by joining a plurality of wires. A wire treating part 130 subjects the wire to be treated delivered by the delivery part 110 to wire treatment including any one of heat treatment and molding. A storage part 150 stores the wire to be treated subjected to the wire treatment by the wire treating part 130. A joined part detection part 120 detects passage of a joined part of the wires in the wires to be treated delivered by the delivery part 110. A cutting part 140 cuts the wire to be treated based on a detection result of passage of the joined part by the joined part detection part 140 between the wire treating part 130 and the storage part 150, and thereby removes the joined part in the wire to be treated.SELECTED DRAWING: Figure 1
Inventors:
FUJIWARA FUMIAKI
MURAYAMA KATSUHIKO
MURAYAMA KATSUHIKO
Application Number:
JP2020172167A
Publication Date:
April 22, 2022
Filing Date:
October 12, 2020
Export Citation:
Assignee:
NETUREN CO LTD
International Classes:
B21C47/26; B21C47/02; B21C47/18; B21C47/24
Attorney, Agent or Firm:
Patent Business Corporation Koei Patent Office