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Title:
WIRE SAW BEADS AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP2000176737
Kind Code:
A
Abstract:

To firmly stick an ultra abrasive grain layer to a sleeve by sticking the ring-like ultra abrasive grain layer to the outer periphery of the cylindrical sleeve having multiple holes on the side face.

A sleeve 3 has a cylindrical shape, and multiple holes 1 are provided on the side face. An ultra abrasive grain layer 6 is formed with a ring-like ultra abrasive grain compact temporarily molded by heating and sintering, the ultra abrasive grain layer 6 is reduced in outer diameter and inner diameter by shrinkage because of the ultra abrasive grain compact, and it partially enters the holes 1 provided on the sleeve 3 and is fixed to the sleeve 3. Wire saw beads are thus manufactured. The wire saw beads and a wire rope are installed in a die, a synthetic resin or raw rubber is injected and filled in the gaps between the inner peripheries of the wire saw beads and the wire rope and the exposed faces of the sleeve 3 and the wire rope, and the synthetic resin is solidified or the rubber is vulcanized to connect the wire saw beads to the wire rope.


Inventors:
MATSUBARA MASA
NOROTA MASANOBU
YOSHIDA DAICHI
Application Number:
JP36137898A
Publication Date:
June 27, 2000
Filing Date:
December 18, 1998
Export Citation:
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Assignee:
ASAHI DIAMOND IND
International Classes:
B23D61/18; (IPC1-7): B23D61/18
Attorney, Agent or Firm:
Uchiyama Mitsuru



 
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