Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
WIRE SAW CUTTER DEVICE
Document Type and Number:
Japanese Patent JPH11254287
Kind Code:
A
Abstract:

To operate a wire saw cutter device under a stable condition, by eliminating abnormal tension applied to a wire.

An ingot 9 is sliced by a wire turned around group rollers 1, 2, and a wafer is cut out. An abnormal tension absorbing mechanism 20 provided between the group rollers 1, 2 and in-coming/ out-going side deflector rollers 18 is provided with a damper roller 21 with a peripheral surface into contact with a wire running route, a frame of the damper roller 21 is connected to a piston of a directional valve 24. At generation time of abnormal tension, when the tension given to the wire rapidly rises, the damper roller 21 is made to instantaneously take refuge from the wire running route, the abnormal tension is eliminated by loosening the wire 5. In this way, the wire is prevented from breaking by abnormal tension easily generated at switching time or the like of a running direction of the wire, and wire saw cutting is continued under a stable condition.


Inventors:
OISHI HIROSHI
ASAKAWA KEIICHIRO
MATSUZAKI JUNICHI
Application Number:
JP6295298A
Publication Date:
September 21, 1999
Filing Date:
March 13, 1998
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUPER SILICON KENKYUSHO KK
International Classes:
B24B27/06; B23D57/00; H01L21/304; (IPC1-7): B24B27/06; H01L21/304
Attorney, Agent or Firm:
Wataru Ogura