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Patent Searching and Data


Title:
WIRE FOR WIRE SAW, WIRE SAW, CUTTING METHOD USING WIRE SAW
Document Type and Number:
Japanese Patent JP2014054716
Kind Code:
A
Abstract:

To provide wire for a wire saw which is excellent in durability, and in which poor curing etc. of a conductive layer does not occur.

A conductive layer 15 is formed of ultraviolet curing resin. Here, when specific surface area of metal particles becomes larger than predetermined size (namely, as the metal particles become finer), sufficient curing by ultraviolet irradiation cannot be obtained. In order to sufficiently cure the conductive layer 15 by the ultraviolet irradiation, it is preferable that the specific surface area of the metal particles contained in the conductive layer 15 is 1.9 m2/g or less. It is because ultraviolet light does not sufficiently spread over the inside of the conductive layer 15, which results in poor curing when the specific surface area of the metal particles exceeds 1.9 m2/g.


Inventors:
NAKAJIMA YASUO
AKITSUKI KAZUYOSHI
HIROISHI JIRO
YAMAMOTO SHUNJI
KUBOTA TETSUJI
MATSUNAGA YOSHINORI
TANAKA NAOKI
Application Number:
JP2012202011A
Publication Date:
March 27, 2014
Filing Date:
September 13, 2012
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
B24D11/00; B24B27/06; B24D3/00; B24D3/06; B28D5/04
Attorney, Agent or Firm:
Seiichi Inoue