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Title:
WIRE SAW AND CUTTING METHOD
Document Type and Number:
Japanese Patent JP2016155197
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wire saw capable of improving processing efficiency.SOLUTION: In a wire saw 1 including a work tank 4 in which working liquid S is stored, and into which a workpiece W is immersed, and a wire 2 having abrasive grains 21 attached onto the surface, for cutting the workpiece W by reciprocating movement of the wire 2, an ultrasonic generation device 10 (processed waste removal part) for removing processed waste attached to the wire 2 in the work tank 4 is provided.SELECTED DRAWING: Figure 1

Inventors:
HIRAOKA KIYOSHI
ONISHI YASUSHI
Application Number:
JP2015035308A
Publication Date:
September 01, 2016
Filing Date:
February 25, 2015
Export Citation:
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Assignee:
KONICA MINOLTA INC
OPTOCERAMICS:KK
SENYO KOGAKU KK
MIKUNI SEIKYO CO LTD
International Classes:
B24B27/06; B23D57/00; B24B53/00; B28D1/22; B28D5/04; H01L21/304
Domestic Patent References:
JPH0386423A1991-04-11
JPH07237199A1995-09-12
JP2003191158A2003-07-08
JPH0796258A1995-04-11
JPH03111104A1991-05-10
JPH11198020A1999-07-27
JPH11277397A1999-10-12
JPH01216759A1989-08-30
JPH1170456A1999-03-16
JP2007054913A2007-03-08
JP2012139810A2012-07-26
Attorney, Agent or Firm:
Sano patent office



 
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