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Patent Searching and Data


Title:
WIRE SAW AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH1044132
Kind Code:
A
Abstract:

To prevent crack or damage of a high hardness particle layer and to efficiently, simply manufacture a wire saw by feeding the saw for cutting a stone at a high speed in the case of using to cut off the stone, and repeatedly receiving stresses of bending and straightening by contact with a driver and a member to be cut off.

The wire saw comprises a core wire 2 made of a high tensile wire 1 having a predetermined length and high hardness particle layers 3 provided at a predetermined interval on an outer periphery of the wire 2. Thus, stresses of bending and straightening to be repeatedly received are absorbed by flexibility of the wire 2 disposed between the layers 3, and hence crack or damage scarcely occurs at the layer 3. The method for manufacturing the saw 1 comprises the steps of masking the outer periphery of the wire 2 made of the wire 1 having the predetermined length with insulators at a predetermined interval, and dipping the masked wire in an electrodeposition tank in which high hardness particles are floated to form the high hardness particle layers 3 at non-masked sites, thereby simply forming the layers 3 at a predetermined interval.


Inventors:
SEKIYA MINOSUKE
Application Number:
JP20158796A
Publication Date:
February 17, 1998
Filing Date:
July 31, 1996
Export Citation:
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Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B23D61/18; B28D1/08; (IPC1-7): B28D1/08; B23D61/18
Attorney, Agent or Firm:
Isao Sasaki (1 person outside)