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Patent Searching and Data


Title:
WIRE SAW
Document Type and Number:
Japanese Patent JP2001062700
Kind Code:
A
Abstract:

To supply a sufficient quantity of slurry between a wire and a workpiece to permit efficient cutting by providing a vibration imparting means coming close to a wire row to impart vibration to the wire through a micro clearance.

Driving output from a driving output generating circuit 44 is supplied to magnetic field generators 21, 22. A wire 7 is drawn downward by the magnetic field from the magnetic field generators 21, 22, and the supply of driving output is stopped to return the wire 7 upward by its own elasticity, thereby imparting a specified cycle of vertical vibration to the wire 7. Vertical progressive waves are therefore generated to the wire 7, and more slurry is led in between the wire 7 and the cut part of a workpiece 11 by the progressive waves to carry out efficient cutting. Since the wire 7 and the magnetic field generators 21, 22 never come in contact with each other, the magnetic field generators 21, 22 are not cut or damaged by the wire 7.


Inventors:
OKUYAMA TETSUO
MURAI SHIRO
Application Number:
JP24558399A
Publication Date:
March 13, 2001
Filing Date:
August 31, 1999
Export Citation:
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Assignee:
NIPPEI TOYAMA CORP
International Classes:
B24B57/02; B24B27/06; B28D5/04; (IPC1-7): B24B27/06; B24B57/02; B28D5/04
Attorney, Agent or Firm:
Hironobu Onda (1 person outside)