Title:
WIRE SAW
Document Type and Number:
Japanese Patent JP3539773
Kind Code:
B
Abstract:
PURPOSE: To provide a wire saw, by which a bar-like material to be cut, which is mainly made of an expensive and hard material such as silicon, chemical compound semiconductor, an oxide monocrystal ceramics or the like can be cut with a high accuracy and high efficiency and with little cut loss.
CONSTITUTION: A wire saw, which is adapted to press a material 7 to be cut fixed on one end of a work holding arm 8 to a traveling wire 1 and cut the same, comprises a mechanism for forcing the material 7 to be cut to reciprocate and rotate, and a mechanism for moving the material 7 to be cut in a plane parallel to the wire, wherein a boundary line between a cut part of the material 7 to be cut and an uncut part to be cut comes into contact with the wire 1 in such a manner as to have such a curvature as to be projected to the wire 1. Further, the wire saw comprises an oscillating mechanism which is provided on the other end part of the work holding arm 8 and adapted to oscillate the material 7 to be cut parallel to the traveling wire 1, taking the rotating shaft 11 of the work holding arm as the center of rotation, and a moving mechanism for moving the material 7 in a plane parallel to the oscillating plane.
Inventors:
Sakaguchi, Arata
Yamada, Toru
Arai, Hide
Ozaki, Jun
Hirasawa, Teruhiko
Kamioka, Masatsugu
Yamada, Toru
Arai, Hide
Ozaki, Jun
Hirasawa, Teruhiko
Kamioka, Masatsugu
Application Number:
JP1994000223245
Publication Date:
April 02, 2004
Filing Date:
September 19, 1994
Export Citation:
Assignee:
SHIN ETSU CHEM CO LTD
International Classes:
B24B27/06; B23D57/00; B28D5/04; B24B27/06; B23D57/00; B28D5/04; (IPC1-7): B24B27/06; B28D5/04