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Title:
ワイヤソー
Document Type and Number:
Japanese Patent JP4236540
Kind Code:
B2
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JP6248401The exposure mask used for the manufacturing method of a semiconductor device, and it
Inventors:
Daisuke Ide
Naoki Toge
Application Number:
JP2003310287A
Publication Date:
March 11, 2009
Filing Date:
September 02, 2003
Export Citation:
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Assignee:
Noritake Super Abrasive Co., Ltd.
Noritake Company Limited
International Classes:
B24B27/06; B24D11/00; B24D3/00; B24D3/02; B24D3/28; B28D5/00
Domestic Patent References:
JP200034646A
JP200236091A
Attorney, Agent or Firm:
Hisashi Kato



 
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