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Patent Searching and Data


Title:
WIRE SEND-OUT DEVICE
Document Type and Number:
Japanese Patent JP11116142
Kind Code:
A
Abstract:

To provide a wire send-out device of simple structure as a whole in which control of the wire send-out tension can be made simple.

This wire send-out device is composed of a capstan device 4 which is fed with a wire 1 paid off from a send-out drum 2 and given an appropriate holding tension and is driven by a drive motor 42, a tension measuring pulley 5 installed downstream of the capstan device 4, a load cell 6 installed on the rotary shaft of the pulley 5 in such a way that the loading direction is approx. identical to the direction in which the wire send-out tension is applied, and a tension adjusting circuit which is installed between the load cell 6 and the drive motor 42 and includes a tension setting apparatus 9 and a CPU 8, whereby the drive of the motor 42 is controlled so that the wire send-out tension becomes identical to the tension set in the tension setting apparatus 9.


Inventors:
Yamada, Yoshinori
Yoshida, Masaki
Application Number:
JP1997000297877
Publication Date:
April 27, 1999
Filing Date:
October 15, 1997
Export Citation:
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Assignee:
YOSHIDA KOGYO KK
International Classes:
B65H59/38; B21F23/00; H01B13/00; B65H59/00; B21F23/00; H01B13/00; (IPC1-7): B65H59/38; B21F23/00; H01B13/00