Title:
複合基板面への線半田付け方法及びそれに用いる治具
Document Type and Number:
Japanese Patent JP3554851
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make it possible to adhere wire solder having perpendicular end faces by fitting an upper mold jig having plural projecting lines on its inside surface to a lower mold jig, charging these jigs into a heating furnace and adhering the solder in a band state onto a metallic plate. SOLUTION: A ceramic substrate joined with the metallic plate is arranged on the inside surface base of a lower mold body and after the sheet-like solder is arranged on the metallic plate, the upper mold body 3 having a groove base 5 and the projecting lines 6 which are plural rectangular members on its inside surface is turned upside down to fit the projections 2, 2' of the lower mold body into holes 4, 4'. The mold bodies are charged in this state into the heating furnace and are soldered. Plural pieces of wire-shaped bodies having nearly the perpendicular end faces of the wire solder 11 are thereby obtd. Mass production is made possible, by using the plural soldering jigs in such a manner, by which the number of stages is decreased and the cost is reduced.
Inventors:
Masaya Takahara
Toru Komatsu
Toru Komatsu
Application Number:
JP21128995A
Publication Date:
August 18, 2004
Filing Date:
July 28, 1995
Export Citation:
Assignee:
DOWA MINING CO.,LTD.
International Classes:
B23K1/008; B23K1/00; B23K3/00; B23K101/42; (IPC1-7): B23K1/008; B23K1/00; B23K3/00
Domestic Patent References:
| JP56119664A | ||||
| JP61014074A | ||||
| JP1109368U | ||||
| JP7088638A |
Attorney, Agent or Firm:
Seiichi Sawaki
Kiichi Sawaki
Kiichi Sawaki