To obtain a favorable wafer cut surface and also machine efficiently at a low cost, in the cutting by the wire with fixed abrasive grains.

In this cutting method, the wire with fixed abrasive grains, in which the abrasive grains having a plural different grain size are mixed and stuck and/or the abrasive grains constituted by the material quality of plural different kinds are mixed and stuck on the wire 12 with fixed abrasive grains used to a fixed whetstone grains wire saw, is used. Thereby, the life of the wire with the fixed abrasive grains can be extended while maintaining the cut surface accuracy of an ingot 30 in a favorable state and a production efficiency is improved and a production cost can be reduced.