Title:
WIRE WOUND ELECTRONIC COMPONENT AND RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2005005644
Kind Code:
A
Abstract:
To provide a wire wound electronic component having improved thermal shock resistance.
The wire wound electronic component comprises a core 1 composed of a ferrite material, a coil conductor 2 wound around a specified region of the core 1, and a sealing part 4 arranged around the coil conductor 2 to seal the coil conductor 2 and containing magnetic powder, low thermal expansion powder having a coefficient of linear expansion of 5.0×10-6 or less and thermosetting resin.
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Inventors:
TANABE KOJI
TEZUKA SHINICHI
TEZUKA SHINICHI
Application Number:
JP2003170450A
Publication Date:
January 06, 2005
Filing Date:
June 16, 2003
Export Citation:
Assignee:
TDK CORP
International Classes:
H01F27/32; H01F17/04; H01F19/00; H01F27/255; H01F30/00; H01F37/00; (IPC1-7): H01F27/32; H01F17/04; H01F19/00; H01F27/255; H01F30/00; H01F37/00
Attorney, Agent or Firm:
Mitsuru Oba